Wafer Level Packaging Process Engineer

Be visionary Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description About the job We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Summary: As part of the Uncooled Detector (Focal Plane Array) Production team, we are seeking a WLP(Wafer Level Packaging) Process Engineer with strong wafer bonding experience to support development and volume manufacturing of wafer-level packaging processes. This role will...