Found Description
Responsibilities
- Work with Broadcom’s IC substrate subcontractors to manage and resolve issues related to packaging, manufacturing, yield, quality, and delivery of high-volume semiconductor devices.
- Lead NPI activity, risk assessments, process improvement & development, and production engineering support of high-volume IC substrate manufacturing.
- Collaborate with Broadcom internal cross‑functional engineering teams to resolve interactive issues and advance new packaging technology toward high-volume manufacturing maturity.
- Conduct pre‑production engineering activities for new products, driving improvements in process, visual mechanical yields, and cycle time.
- Develop and enforce site‑to‑site standardizations in Best Known Methods, and verify compliance with Broadcom requirements.
- Drive capability enhancement and cost‑reduction projects.
Qualifications
- Bachelor’s degree in engineering (Mechanica...