Senior/Staff Process Engineer (Flip Chip)

Core Responsibilities

• Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
• DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
• Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
• Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
• Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, m...