Senior Wire Bond & Die Attach Process Engineer (Onsite)

II-VI UK, Ltd. is seeking a qualified professional in Ipoh, Malaysia to improve and sustain the Die Attach & Wire Bond Process. The candidate will collect data to generate engineering reports and ensure the assembly yield meets KPI targets.

Successful candidates should possess a Bachelor's degree in Engineering, ideally in Electronics. Experience in high volume manufacturing and strong analytical skills are essential for this full-time onsite role.