Senior Wafer-Level Packaging Engineer - Advanced Packaging

Micron is seeking a process development professional to drive post-fab wafer finishing technologies for high-performance memory products in Singapore. You will collaborate with cross-functional teams to deploy new processes, optimize yield, and reduce costs while maintaining reliability and schedule adherence.

The role emphasizes collaboration across Packaging, Front End Wafer Fab, Assembly/Test, Product Engineering and Global Quality to transfer new processes into high-volume manufacturing with