Senior SMTS Packaging Engineer — AI-Driven 2.5D/3D Design

AMD is seeking an experienced SMTS Package Design Engineer in Singapore to drive complex substrate and interposer designs for 2.5D/3D architectures. You will lead design execution, work with internal teams and external OSATs, and push AI‑driven methodologies for faster, higher‑quality results.

The role requires strong ownership, ability to handle multiple programs, and hands‑on experience with advanced packaging tools and flows. Apply now to shape next‑gen packaging technology.