Senior Semiconductor Packaging Engineer - High-Speed SerDes

Link-Worldwide is seeking a Semiconductor Packaging Engineer located in Mexcio, Estado de México. The ideal candidate should have over 8 years of experience in flip-chip-BGA package design, including knowledge of high-speed SerDes and Cadence APD tools.

The role demands advanced skills in signal integrity and power integrity packaging, as well as self-management and organizational abilities. Join a leading team in semiconductor solutions!