Senior Semiconductor Packaging Engineer – Flip-Chip & SI

Link-Worldwide is hiring a Semiconductor Packaging Engineer in Guadalajara. The ideal candidate will have over 8 years of experience in flip-chip BGA package design and expertise in Cadence APD or similar tools.

The role involves ensuring package-level signal integrity and power integrity, alongside excellent self-management. This is an exciting opportunity to work in a dynamic environment focused on innovation.