Senior Semiconductor Packaging Engineer – Flip-Chip & Si

Link-Worldwide is hiring a Semiconductor Packaging Engineer in Guadalajara.
The ideal candidate will have over 8 years of experience in flip-chip BGA package design and expertise in Cadence APD or similar tools.The role involves ensuring package-level signal integrity and power integrity, alongside excellent self-management.
This is an exciting opportunity to work in a dynamic environment focused on innovation.
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