Senior Scientist II, Process Modules, APM, IME

Research Scientist – Temporary Wafer Bonding & Debonding (R&D)

Enable the Future of Advanced Semiconductor Packaging

We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root‑cause analysis and imp...