Senior R&D Engineer, Advanced Packaging (5nm/3nm)

Dormont Manufacturing Co in Singapore is seeking a highly skilled packaging engineer to work on custom packaging solutions for advanced silicon nodes. You will collaborate with marketing, IC design, and engineering teams to ensure high performance, manufacturability, and reliability of packaging.

Candidates should have a strong background in signal and power integrity, project management skills, and extensive hands-on experience with advanced assembly processes for cutting-edge silicon technology.