Senior Process Engineer, 3D Integration & Packaging

A leading global semiconductor supplier in Helsinki is seeking a Senior Process Engineer to develop innovations in atomic layer deposition. This role involves leading strategies for device integration, conducting experiments, and collaborating across teams. Candidates should possess a PhD in relevant fields and have at least 3 years of experience in semiconductor processing. Skills in thin film deposition and a strong understanding of semiconductor physics are essential. Join us to push the boundaries of technology and improve lives around the world.
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