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Senior Principal Software Engineer: Packaging Architecture

ASM

singapore, singapore, Singapore Full-time June 28, 2026

Found Description

A leading semiconductor company in Singapore is seeking a Senior Principal Engineer in Software Engineering to shape critical software for advanced packaging and hybrid bonding equipment. The ideal candidate will have a Bachelor's or Master's degree in Computer Science, over 10 years of software development experience, and expertise in C++. This role involves leading software architecture decisions and collaborating across functions to ensure robust product delivery. Strong leadership and project management skills are essential, along with a focus on quality.
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