Senior PFA Packaging Engineer (SEM/FIB)

Sandisk seeks an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. The role integrates with CPI Failure Analysis and collaborates with wafer fabrication, package design, assembly R&D, and characterization teams.

The position focuses on improving device reliability, leading package evaluation for NAND/ASIC, and informing design decisions through detailed failure analysis.