Senior Packaging & NPI Engineer: Lead Product Ramp

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a PIE Engineer based in Singapore. The role involves leading the new product transfer process from NPN to high volume manufacturing and managing the entire product lifecycle.

Candidates should have a Master's or Bachelor's degree in Engineering and at least 8 years of experience in the semiconductor industry. Strong packaging knowledge and data analysis skills, particularly in JMP, are essential for success in this position.