Senior Packaging Engineer: Semiconductor Wirebond Lead

Power Integrations is seeking a Staff Packaging Engineer located in Ayutthaya, Thailand. This role involves becoming the on-site technical owner at the OSAT for packaging operations, ensuring product quality, yield, and on-time delivery.

The ideal candidate will have a B.S. in engineering, 8 years of experience in semiconductor assembly, and strong knowledge of wirebond processes. The role requires willingness to be based full-time at the OSAT site with occasional travel to the Malaysian operations hub in Penang.