Senior Packaging Engineer - On-site OSAT Wirebond & Yield

Power Integrations in Malaysia seeks a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi‑die wirebond lead‑frame packages. You will focus on sustaining manufacturing performance, process control, and robust RTM protocols to ensure product quality, yield and on‑time delivery.

Requirements include a B.S. in engineering and 2+ years in semiconductor back-end assembly, with willingness to be based full‑time at the OSAT site and occasional travel to Penang.