Senior Packaging Engineer – AI-Driven 2.5D/3D

AMD is seeking a highly experienced SMTS Package Design Engineer to lead end-to-end package design for complex products, including 2.5D/3D and chiplet-based architectures. The role emphasizes AI-driven design, automation, and fast-paced delivery with high quality.

The candidate will collaborate with SI/PI, mechanical, and SOC teams, mentor junior engineers, and help standardize design methodologies while advancing packaging practices across multi-project programs in a data-center and AI-focused