Found Description
Our international client is currently searching for a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from package concept and technology selection through design, validation, qualification, and manufacturing handover. Working closely with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions will be required.
Key Responsibilities
- Develop and optimize advanced semiconductor packages (wirebond, flip‑chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
- Evaluate packaging technologies and drive supplier/manufacturing partner development.
- Design packages to meet electrical, thermal, and form‑factor requirements, including back‑end wafer process considerations.
- Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
- Support validation, testing, custom...