Found Description
Responsibilities
- Own the process application and performance of the die bonder product portfolio across key packaging segments
- Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
- Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
- Drive yield, reliability, and downtime reduction through structured data analysis and root cause analysis
- Set technical direction for die bond equipment strategy, automation, and future technologies
- Act as senior escalation point and technical authority for complex product and customer issues
- Lead, mentor, and develop a team of product and application engineers with strong competence in die attach applications, tool capability, and problem‑solving
- Partner with R&D, Manufacturing, Quality, and Supply Chain to deliver robust, scalable solutions
- Ensure die bonder products remain...
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