Senior Lead Frame & Substrate Packaging Engineer

Infineon Technologies in Malacca City is seeking a skilled engineer to perform design and specifications for lead frames and substrates. The role involves collaboration with suppliers and driving development activities to meet project milestones.

The ideal candidate holds a Bachelor’s Degree in relevant engineering fields and has at least 3 years of experience in semiconductor assembly and packaging development.

Familiarity with AutoCAD and materials physics is essential.