Senior IC Package Design Engineer - High-Speed SerDes

Link-Worldwide is looking for an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes. You'll collaborate with a global R&D team to develop high-performance package designs for ASICs in AI, networking, HPC, and 5G.

The ideal candidate will have over 8 years of experience in package design, specifically with flip-chip-BGA technology and high-speed applications. This role offers a chance to work on groundbreaking technologies.