Senior ECP Copper Process Engineer - Thin Film & Yield

ST is seeking a Senior Process Engineer to own the Electro‑Chemical Plating copper process on the LAM Novellus SABRE platform. You will drive development, sustainment, and collaboration across equipment engineering to improve robustness, yield, and tool performance.

You will implement process recipes, tune hardware, and work with upstream/downstream teams to ensure tight integration with barrier/seed and other steps. Strong problem‑solving and communication skills are essential.