Senior Application & Technical Sales Engineer (Semiconductor Packaging - Flip Chip Bonding) - YZ11

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary :SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
• Support technical sales activities and customer discussions.
• Benchmark competitor equipment and identify technology gaps.
• Translate customer requirements into internal equipment specifications.
• Develop and optimize TCB process parameters on TCB Equipments.
• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and...