Senior 3D-IC Integration Engineer (TSV/HB)

Bitdeer is seeking a senior 3DIC/advanced-packaging engineer to lead the integration of TSV/hybrid-bonded stacks for AI and mining hardware. You will own cross-functional interfaces with foundry, memory IP partners, and OSAT, shaping the 3D methodology from concept to production.

We value hands-on experience with wafer-level packaging, 3D signoff, and strong collaboration in a fast-growing environment. Singapore-based role with growth opportunities and competitive welfare benefits.