Senior 2.5D/3D Packaging Engineering Lead

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a seasoned professional to lead the 2.5D/3D Advanced Package Engineering in Singapore. The role encompasses overseeing engineering support for New Product Introduction and High-Volume Manufacturing, managing programs and budgets while supervising direct reports.

The ideal candidate holds a bachelor’s degree in engineering or related fields, with at least 10 years of experience in the semiconductor industry, specifically in 2.5D/3D packaging processes.