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Semiconductor Packaging Engineer (Guadalajara)Employer:Global Connect TechnologiesWe are seeking an experienced engineer with expertise in:8+ years of experience in flip‐chip BGA package design with high‐speed SerDes (BSEE or similar field) or 6+ years of experience in related fields such as MSEE.Proficiency with Cadence APD (Allegro Package Designer) or equivalent tools.Strong knowledge of package‐level signal integrity and power integrity.Excellent self‐management and organizational skills.
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