Found Description
Semiconductor Packaging Engineer (Guadalajara)
Employer: Global Connect Technologies
We are seeking an experienced engineer with expertise in:
8+ years of experience in flip‐chip BGA package design with high‐speed SerDes (BSEE or similar field) or 6+ years of experience in related fields such as MSEE.
Proficiency with Cadence APD (Allegro Package Designer) or equivalent tools.
Strong knowledge of package‐level signal integrity and power integrity.
Excellent self‐management and organizational skills.
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