Semiconductor Packaging Engineer - Flip-Chip & SI/PI Expert

Link-Worldwide is looking for an experienced Semiconductor Packaging Engineer in Sonora. The ideal candidate will have 8+ years of experience in flip-chip BGA package design and proficiency in Cadence APD or equivalent tools.

This role requires strong knowledge of package-level signal integrity and excellent self-management skills. Candidates will be expected to contribute significantly to packaging engineering projects.