Scientist (Heterogeneous Integration), IME

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a Scientist/Senior Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation.

• Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high-impact projects with manageable risks and mentor less experienced colleagues.
• Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
• Research and develop advanced packaging technology such as flip-chip and hybrid bonding techniques for 2.5D and 3D IC applications.
• Inve...