Reliability Engineer – Thin-Film & ASIC Bonding

Talent is seeking a Reliability Testing Engineer in Barcelona. The role involves developing methodologies for evaluating packaged devices and optimizing bonding approaches for ASICs integrated with thin-film structures.

The ideal candidate will hold a recently completed PhD in a relevant field and must have experience in thin-film reliability and advanced packaging techniques. A proactive mindset and strong technical communication skills are essential for success in this role.