Found Description
We are seeking a Reliability Testing Engineer with a recently completed PhD and a strong background in thin‑film reliability for implantable or bioelectronic systems, together with experience or familiarity in bonding rigid structures such as ASICs onto flexible polyimide‑based thin‑film devices. The candidate will contribute both to the development and optimization of bonding approaches for ASIC‑integrated thin‑film systems and to the design and execution of stability and reliability studies for packaged devices. You will combine hands‑on experimental work with deep technical analysis, identify failure mechanisms across material, interface, bonding, and package levels, and collaborate with multidisciplinary teams to improve the robustness of next‑generation neurotechnology.
Main Responsibilities
- Develop test methodologies for evaluating packaged devices in physiologically relevant and in vivo‑inspired conditions, with attention to moisture ingress, delaminat...