R&D Design & Packaging Tech Lead — WLP, Bump, Die Sort

A leading technology company in Singapore seeks a Senior Technical Specialist in RF Front End Modules within the Engineering Group. This role involves developing new technology platforms and requires extensive experience in semiconductor packaging and process engineering. The ideal candidate must have strong cross-functional collaboration skills and a solid technical background. Responsibilities include resolving manufacturing issues, leading technology integration, and collaborating with various teams to enhance product reliability and efficiency.
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