Process Development Engineer: Die Attach & Flip Chip

Dormont Manufacturing Co in Malaysia, Penang is seeking an experienced engineer to develop and optimize Die Attach and Flip Chip assembly processes. The ideal candidate will have a Bachelor's or Master's degree in Electrical Engineering, Materials Science, or Mechanical Engineering, coupled with 3-10 years of experience in semiconductor packaging.

Responsibilities include providing engineering support, driving improvement initiatives, and ensuring compliance with quality standards. Candidates must possess hands-on experience with die bonding techniques and problem-solving skills.