Process Development Engineer: Die Attach & Flip Chip

1326 Analog Devices Manufacturing (Malaysia) Sdn. Bhd. is hiring for a position involving the development and optimization of Die Attach and Flip Chip assembly processes in semiconductor packaging. Candidates should possess a Bachelor's or Master's degree in relevant fields and have 3–10 years of experience in assembly manufacturing.

Responsibilities include process engineering support, troubleshooting yield and quality issues, and driving continuous improvement initiatives. The company values diversity and fosters an inclusive culture for all candidates.