Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Principal/Staff Engineer – Advanced Packaging Die Level Technology Engineering

Develop and enable deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows that drive the future.

Key Responsibilities and Duties

• Process Development:
  • Develop and optimize assembly processes for advanced packaging technologies, including wafer‑level packaging and die stacking (Chip on Wafer, Chip to Wafer).
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
  • Establish and enhance process‑management projects to deliver technology‑node requirements.
• Equipment and Materials:
  • Evaluate and promote new equipment and mate...