Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron’s Advanced Packaging Technology Development (APTD) is responsible for delivering package development for high performance memory products and transferring to manufacturing. The role focuses on developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements.

• Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer‑level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.
• Equipment and Materials: Evaluate and promote new equipment and materials to enhance process capabilities; set up process parameters for a ...