Found Description
Elevate Semtech's Datacenter connectivity solutions as a Principal Engineer in IC Package Design. Your expertise in high-speed design and signal integrity will drive impactful results in this on-site role.
At Semtech's Signal Integrity Products (SIP) Business Unit, you will lead advanced design efforts for high-speed IC packages. Collaborate with engineers to ensure reliable, state-of-the-art packaging that meets rigorous technical and financial demands. Your contributions will influence next-generation data communications and video broadcast systems.
Key Responsibilities:
• Design high-speed IC packages and Chip-On-Board (COB) solutions
• Perform 3D signal integrity modeling and experimental validation
• Prepare technical reports and application notes for diverse audiences
• Create PCB layouts for reliability qualification
• Mentor junior engineers and drive design process improvements
Requirements:
• Bachelor's degree in Electrical or Physics Engineering
At Semtech's Signal Integrity Products (SIP) Business Unit, you will lead advanced design efforts for high-speed IC packages. Collaborate with engineers to ensure reliable, state-of-the-art packaging that meets rigorous technical and financial demands. Your contributions will influence next-generation data communications and video broadcast systems.
Key Responsibilities:
• Design high-speed IC packages and Chip-On-Board (COB) solutions
• Perform 3D signal integrity modeling and experimental validation
• Prepare technical reports and application notes for diverse audiences
• Create PCB layouts for reliability qualification
• Mentor junior engineers and drive design process improvements
Requirements:
• Bachelor's degree in Electrical or Physics Engineering
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