Principal Engineer, Advanced Packaging & Tech Strategy

Stats ChipPAC Management Pte. Ltd.

in Singapore seeks a senior technology platform leader to establish and advance processes, materials, and equipment roadmaps that support New Packages (NP), Evolutionary Packages (EP), New Technologies (NT), and Emerging Technologies (ET) in alignment with the company’s development roadmap. The role drives technology scouting, capability assessment, material and equipment strategy, and the successful implementation of advanced manufacturing technologies to