Packaging Module Development Engineer: Direct Lid/Stiffener

Intel Corporation in Kulim, Malaysia is seeking a Package Module Development Engineer to define and establish process flows for new packaging modules. Candidates must have a Bachelor's or Master's degree in engineering and experience in process development, especially in the semiconductor field.

This role demands strong problem-solving and analytical skills. The successful candidate will be involved in high-volume manufacturing support and the transfer of processes to production lines.

Expect on-site work and the chance to contribute to cutting-edge semiconductor technology initiatives.