Packaging & Assembly Engineer: From NPI to High-Volume

Lattice Semiconductor in Muntinlupa, Philippines, is seeking a Packaging Lead to oversee New Product Introduction (NPI) activities and ensure the quality and adherence to specifications in assembly processes of high volume manufacturing products. You will be responsible for driving continuous improvements, supporting transitions from NPI to HVM, and leveraging AI for data analytics.

The ideal candidate will have a strong background in packaging, project management skills, and experience in working collaboratively with subcontractors to achieve high performance standards.