Package Design Engineer - Microelectronics (Hybrid/Telework)

Teledyne Technologies Incorporated is seeking a Package Design Engineer based in Sevilla, Spain. The successful candidate will manage the design flow of advanced microelectronic packages, ensuring alignment with customer needs, specifications, and timely project reviews.

Qualifications include a strong background in microelectronics or related fields and confirmed experience in packaging design. Fluency in English and French, with Spanish as a plus, is required. Join us for an innovative work environment focused on technological excellence.