Lead PECVD Process Engineer for Photonics & Packaging

A research institute in Singapore is seeking a qualified candidate to develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes for advanced packaging and photonics applications. The ideal candidate will have at least 3 years of experience in semiconductor thin film modules, strong communication skills, and hands-on experience with characterization techniques. Responsibilities include troubleshooting film properties and preparing technical reports for stakeholders.
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