Found Description
The Role
Join a world‑class team driving power integrity solutions for AMD’s next‑generation SoCs and advanced packaging technologies. In this role, you’ll define and optimize power delivery networks, perform IR‑drop and EM analysis using industry‑leading tools, and shape design methodologies for cutting‑edge CPU/GPU products. You’ll partner closely with physical design, packaging, and CAD teams, gaining exposure to advanced 3DIC integration and high‑performance compute challenges. This is an opportunity to influence architecture‑level decisions and work in a collaborative, innovation‑driven environment.
The Person
The ideal candidate is detail‑oriented, proactive, and thrives in a fast‑paced, cross‑functional environment. Strong communication, problem‑solving, and a drive for continuous improvement are key. You are someone who enjoys debugging complex issues, collaborating with global teams, and developing automation to streamline workflows.