IC Package Design Engineer - High-Speed SerDes & Power

Link-Worldwide in Chihuahua seeks an Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes in industry-leading ASICs. The role involves collaborating with an international R&D team to develop innovative designs for artificial intelligence, networking, HPC, and 5G applications.

The ideal candidate will have over 8 years of experience in package design and a strong understanding of signal and power integrity. This position offers the opportunity to manage projects from requirements gathering to manufacturing delivery.