Head of Package Quality & Reliability Engineering

Micron Technology, Inc. seeks a Director of Package Quality & Reliability Engineering to lead reliability qualification across NPI and high-volume manufacturing. You will coordinate with PDE, front-end fabrication, and quality teams to drive design for reliability, robust qualification, and data-driven risk mitigation.

You will build team capability, establish KPIs, and manage budgets while guiding advanced packaging strategies for mobile, data center, automotive, and AI/HPC applications.