HBM Product Engineer — Yield & Innovation Lead

Micron Technology is seeking an experienced HBM Packaging Product Engineer in Singapore. You will drive yield improvements, collaborate with FAB, HBM Technology Development, Design and Quality teams, and lead initiatives to optimize processes and reduce costs. Travel to Taiwan, the US and Japan is required.

The role emphasizes data-driven problem solving, AI/ML validation, and cross-functional leadership to deliver high-quality HBM products on schedule.