Found Description
Primary Duties & Responsibilities
- Responsible for sustaining & improving the Die Attach & Wire Bond Process.
- Overall knowledge on electronics manufacturing and must be able to collect and analyze data to create engineering reports for new products and regular production.
- Monitor and maintain assembly yield within KPI target.
- Key involvement in improving the systems to bring down scrap rate due to process excursions.
- Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly.
- Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target.
- Support engineering initiatives in evaluating solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically.
- Develop manufacturing work instructions and production routes along wi...