Engineer, Process Development Engineering

Responsibilities

1. Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
2. Provide process engineering support for production lines, including troubleshooting yield and quality issues.
3. Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
4. Support new product introduction (NPI) and process transfer from development to high‑volume manufacturing.
5. Work closely with equipment, materials, and product engineering teams to resolve process‑related issues.
6. Establish and maintain process documentation, specifications, and control plans.
7. Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
8. Analyze failure modes and reliability concerns related to Die Attach and Flip Chip processes.
9. Interface with equipment vendors and material suppliers to qualify new te...