Engineer II - Failure Analysis

Job Description

The Failure Analysis (FA) Engineer performs detailed electrical and physical failure analysis of all Microchip products using non‑destructive analytical tools and advanced FA techniques. Responsible for providing FA reports, updates, and timelines to customers and working with cross‑functional teams to resolve FA cases.

Responsibilities

• Perform detailed electrical and physical failure analysis for all MCHP products using non‑destructive analytical tools (X‑ray, Scanning Acoustic Microscope, optical microscopes), electrical bench verification tools, ATE data log interpretations, circuit schematic interpretation, and fault isolation techniques.
• Use defect/fault localization techniques such as Photo Emission Microscope, Thermal Emission/Hotspot Analysis, Optical Beam‑Induced Resistance Change, and die‑level microprobing.
• Conduct delidding/delayering techniques (chemical and laser decapsulation, chemical etch, dry etch, ...